September 2016 e-newsletter of The Journal of Electronic Packaging

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ASME Journal Program

The ASME Journal Program publishes peer-reviewed content for researchers and practitioners in the mechanical engineering community. The journals are included in all of the top indexes, and are...
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  • September 2016 e-newsletter of The Journal of Electronic Packaging

    The newsletter, issued quarterly, will keep you abreast of the latest research developments in our field. Below you will find an opportunity to publish papers in JEP by March 2017, new review articles, ASE's picks for industry readers, a link to the current issue, a special IMECE issue, information on how to publish IEEE conference papers in JEP, and JEP LinkedIn page.

    Thank you for taking the time to read this newsletter and please don't hesitate to provide feedback.

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