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Welcome to the December 2016 eNewsletter of the Journal of Electronic Packaging (JEP). The eNewsletter, issued quarterly, will keep you abreast of the latest research developments in our field. Below you will find a special issue with GE papers, an opportunity to publish papers in JEP by 2017, JEP awards, top five downloads, new review articles, InterPACK 2017 http://electronicpackaging.org, and reach-out to Web of Science.
View pdf download.
"I have enjoyed the camaraderie and professional development that the society offers."
Roger E. A. Arndt, Ph.D. ASME Life Fellow since 1963
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