A NOTE FROM THE EDITOR:

PARTICIPANT-CREATED GROUP

ASME Journal Program

The ASME Journal Program publishes peer-reviewed content for researchers and practitioners in the mechanical engineering community. The journals are included in all of the top indexes, and are...
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  • A NOTE FROM THE EDITOR:

    Welcome to the December 2016 eNewsletter of the Journal of Electronic Packaging (JEP). The eNewsletter, issued quarterly, will keep you abreast of the latest research developments in our field. Below you will find a special issue with GE papers, an opportunity to publish papers in JEP by 2017, JEP awards, top five downloads, new review articles, InterPACK 2017
    http://electronicpackaging.org, and reach-out to Web of Science. 

    View pdf download.

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