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Greetings CIE Community!
The 2021 ASME IDETC CIE Conferences are finally here! Though we are virtual once again, there is no shortage excellent presentations and papers from throughout the community. We would like to highlight a few important events that we hope you are all able to join:
Tuesday, August 17
3:20 PM ET: CIE Keynote Talk: Design of Networked Systems (from Raju Mattikalli)
5:30 PM ET: CIE TC Meetings (See details on the CIE Web site)
Wednesday, August 18
1:00 PM ET: CAPPD Panel: Generative Design: Succeed or Fail in Product Development
5:30 PM ET: CIE Division Meeting
Thursday, August 19:
11:10 AM ET: CIE Keynote Panel with Digitalization Technology Group: Digitalizing the Engineering Organization- The Next Steps
Further information on each of these events is available on the webiste. We look forward to seeing you all soon!
Mahesh Mani- CIE Conference Chair
Paul Witherell- CIE Program Chair
CIE Division Meeting on August 18 at 17:30 EST.
4 Parallel TC Meetings on August 17 at 17:30 EST.
CIE CAPPD: https://zoom.us/j/86303215034
Meeting ID: 958 3063 1623, Passcode: ams
CIE VES: https://polimi-it.zoom.us/j/81278104181?pwd=Z3ZqZEgvWndTdjR6SGpUa2hGT3Zkdz09
Meeting ID: 812 7810 4181, Passcode: 306157
CIE SEIKM: https://zoom.us/j/95285096079?pwd=aWxWc2x4QjMvOVY1OXNMbnBQZnp1Zz09
Meeting ID: 952 8509 6079 Passcode: 80u2mj
The ASME Computers and Information in Engineering (CIE) Division is pleased to announce the extension of the due date to May 31st for the following awards:
You may follow the link to all the above mentioned awards: https://community.asme.org/computers_information_engineering/w/wiki/3714.honors-awards.aspx
The nomination packet needs to include the nomination letter, candidate's full CV, two additional reference letters, other support materials if any, and the candidate's dissertation if for the best Ph.D. dissertation award.
Please email the nomination packet as PDF files to Yan Wang (CIE Awards Chair) at firstname.lastname@example.org.
Similar to the past years, ASME-Computers and Information in Engineering (CIE) Division is hosting the Graduate Research Poster Session at the ASME IDETC-CIE Virtual Conference, August 17-20, 2021. The session is an opportunity for graduate students in the preliminary phase of their research programs (MS or within 2 years of starting a Ph.D.) to present their ongoing work and preliminary results to the CIE research community.
The submission process, application package templates, deadlines, organizer’s contact information, and other relevant information is available at: https://event.asme.org/IDETC-CIE/Program/ASME-CIE-Graduate-Research-Posters
What: ASME-CIE Graduate Research Poster Session When: During the 2021 ASME IDETC-CIE Virtual Conference, August 17-20, 2021
Who: Graduate students in the preliminary phase of their research programs (MS or within 2 years of starting a Ph.D.) Deadline for submitting application package: April 20, 2021
The ASME-CIE division will offer stipends (award amount equal to the students’ CIE virtual conference registration) to support graduate students attending the 2021 CIE Virtual Conference to present their research posters. The research poster should be relevant to the areas of interest of one or more CIE Technical Committees, please see the attached pdf or the link provided above for more details. Submissions reflecting relevant and high-quality research will be favored in the awarding process.
Please share the poster session information with your graduate student colleagues who might be interested.
For specific queries, please email: email@example.com
Young Moon, Ph.D., P.E. William J. Smith Professor in Manufacturing Enterprises Department Chair, Mechanical and Aerospace Engineering
Friday, January 29th 2021 (11:00am EST)
Zoom Meeting Details
Zoom link: https://purdue-edu.zoom.us/j/93645942993?pwd=dnY5OUptWVJoa0NNTzNGc0Z1WitLZz09
Meeting ID: 936 4594 2993
Abstract: Cyber-Manufacturing System (CMS) offers a vision for advanced manufacturing systems where physical components are seamlessly integrated with computational processes in a locally as well as globally connected environment. CMS promises significant improvements in productivity, quality, cost, and flexibility by utilizing the latest technologies such as the internet of things, cloud technology, data analytics, and machine learning. One prominent feature of CMS is its unprecedentedly high level of connectivity— sensors/actuators to manufacturing devices, to industrial control systems, to enterprise computer systems, and to other factories or suppliers in dynamically forming supply chains. However, this very ubiquitous connectivity—combined with the elevated use of digital technologies—unintentionally enlarges the attack surface of the CMS. As the vulnerabilities in CMS lie at the intersections of cyber, manufacturing, and human elements, the CMS security has to address their interrelated issues. This webinar presents an overview of the CMS security challenges along with some research results from taxonomy and testbed development, intrusion detection, and insider attacks and prevention.
Speaker Bio: Young B Moon is William J. Smith Professor in Manufacturing Enterprises and Department Chair of the Department of Mechanical and Aerospace Engineering at Syracuse University. He has also served as Kauffman Professor of Entrepreneurship and Innovation and the faculty coordinator for the SAP University Alliance program. He received a Bachelor of Science degree in Industrial Engineering from Seoul National University, Seoul Korea, a Master of Science degree in Industrial Engineering and Engineering Management from Stanford University, and a Ph.D. degree in Industrial Engineering from Purdue University. Professor Moon’s research and teaching interests include Cyber-Manufacturing Systems, Product Realization Processes and Systems, Sustainable Manufacturing, Enterprise Resource Planning (ERP) Systems, Systems Modeling and Simulation, and Machine Learning Applications. A Fulbright Scholar, Dr. Moon has held visiting positions in various organizations such as MIT (Massachusetts Institute of Technology), KAIST (Korea Advanced Institute of Science and Technology), Universidad Carlos III de Madrid, University of Pennsylvania, Boğaziçi Üniversitesi, Univerza na Primorskem, Univerzitet u Sarajevu, Instituto Federal Fluminense, Universidade de São Paulo, Universidade Estadual Paulista, NIST (National Institute of Standards and Technology), and HP Labs (Hewlett Packard Labs).
For recordings of previous webinars in this series, please visit: https://www.youtube.com/channel/UCMc90eQeyP2w4e70QRXLQ4Q
The Winter Newsletter of the Computers and Information In Engineering Division is now available. Download it now to read:
CIE Call for Papers Topic Summary 2021 download document.
ASME CIE Cybersecurity in Manufacturing Webinar # 2
Friday, December 18th at 11:00am EST
We are pleased to invite you to the second ASME CIE division’s Cybersecurity in Manufacturing Webinar. Joshua Lubell from National Institute of Standards and Technology (NIST) will present on “Protecting Additive Manufacturing Information when Encryption is Futile: A Case Study Employing NIST Cyber Risk Management Guidance”. The abstract and speaker bio are included below.
The meeting details are as follows:
Zoom meeting Link: https://purdue-edu.zoom.us/j/98273374626?pwd=T0VmSDAxMUR3L296YlR2MDg4ekp2UT09
Meeting ID: 982 7337 4626
Jitesh Panchal, Chair, ASME Computers and Information in Engineering (CIE) Division
Yan Wang, Awards Chair, ASME Computers and Information in Engineering (CIE) Division
Protecting Additive Manufacturing Information when Encryption is Futile: A Case Study Employing NIST Cyber Risk Management Guidance
Abstract: Recent research shows how a side-channel attack on a Fused Deposition Modeling (FDM) 3D printer can bypass encryption-based defenses to obtain proprietary design information. This result has critical implications for manufacturing supply chains. Three widely used and complementary cyber risk management specifications from NIST can help point the way for manufacturers in protecting against such attacks - when the usual defenses are inadequate. These specifications are the "Framework for Improving Critical Infrastructure Cybersecurity" (commonly known as the Cybersecurity Framework), "Security and Privacy Controls for Information Systems and Organizations" (Special Publication (SP) 800-53), and "Protecting Controlled Unclassified Information in Nonfederal Systems and Organizations" (SP 800-171). This talk provides an overview of the three specifications, discussing what each provides. Following the overview, I then show how a manufacturer can use the specifications together to determine the appropriate security measures to implement for protection against the side-channel attack scenario.
Bio: Joshua Lubell is a computer scientist whose work focuses on smart manufacturing systems cybersecurity. His technical interests include markup languages and information modeling. His Baseline Tailor software tool for security control selection won an award from Government Computer News. He is also a past winner of the Department of Commerce Silver Medal for his leadership in developing ISO 10303-203, a standard for representation and exchange of computer-aided designs. Other past awards include the NIST Bronze Medal for creating data models to support the life cycle of engineered equipment, and the PDES, Inc. Bryan K. Martin Technical Excellence Award for contributions to the ISO 10303 modular architecture and implementation methods.
We are pleased to invite you to ASME CIE division’s Cybersecurity in Manufacturing Webinar on November 20th at 11:00am – 12:30pm EST.
The focus of this month’s webinar will be on Additive Manufacturing security. The webinar includes two talks:
The meeting details, along with abstracts and speaker bios are included below.
Zoom meeting Link: https://purdue-edu.zoom.us/j/95423513868?pwd=VlJjSSs0UUUyTkhoRnFDNkQxMWJzdz09
Meeting ID: 954 2351 3868 Passcode: 698597
Additive Manufacturing Security: Welcome to the New Frontier
Abstract: Additive Manufacturing (AM), often referred to as 3D printing, is a rapidly growing multibillion-dollar industry. AM is increasingly used to manufacture functional parts, including components of safety critical systems. However, its high degree on computerization and reliance on digital design files makes AM susceptible to a variety of cyber and cyber-physical attacks. This talk will provide an introduction in AM Security, a new and highly inter-disciplinary field of research. On the example of several selected attacks, this talk will outline novel challenges that the security of this manufacturing technology faces. While cyber-security is a necessary component of AM Security, numerous characteristic aspects of this manufacturing technology require special considerations. Fortunately, novel approaches have emerged that address some of the identified security threats. This talk will conclude with a summary of current state of the field and point out limitations that must be addressed by the research community in the future.
Speaker Bio: Dr. Mark Yampolskiy is an Associate Professor at Auburn University, department of Computer Science and Software Engineering (CSSE). He is also an Affiliated Faculty with Auburn Cyber Research Center (ACRC) and National Center for Additive Manufacturing Excellence (NCAME). He was among the pioneers and is one of the leading experts in the field of Additive Manufacturing Security. His research interests include the cyber-physical means of attack and defense in AM.
Manufacturing Security: Yes, Mechanical Engineers can Protect Designs and Intellectual Property
Abstract: Additive manufacturing (AM), also called 3D printing, is now used for manufacturing parts that have been deployed in operational aerospace systems. AM is a completely digital system until the part is manufactured on a 3D printer. The cyber-physical nature of the process chain exposes it to cybersecurity risks that include sabotage, intellectual property theft and counterfeiting. Cybersecurity methods such as access control, password protection and encryption can be applied to design files but these methods do not protect against production of high quality parts from stolen files and reverse engineering. Security should be used as a design constraint like any other product performance metric. This talk will introduce the design based security paradigm with examples such as embedded features in the CAD models that do not allow printing high quality parts by unauthorized users, anti-reverse engineering methods and genuine product identification methods. The fundamentally different process chain of AM compared to the traditional manufacturing methods requires a new design thinking that can lead to high quality products with security embedded in the design or the physical product.
Speaker Bio: Dr. Nikhil Gupta is a professor of Mechanical and Aerospace Engineering at New York University. He is affiliated with NYU Center for Cybersecurity. His research program is focused on additive manufacturing, including security and manufacturability of products, machine learning methods for materials characterization and lightweight composite materials. Dr. Gupta’s research directions on additive manufacturing security are supported by National Science Foundation, SecureAmerica Institute as well as industry. He is an author of over 205 journal papers and book chapters, inventor of 4 US patents and serves on the editorial board of journals including Composites Part B, Materials Performance and Characterization and Materials Science and Engineering A.
The new CIE webinar will feature a panel of experts discussing the use of Artificial Intelligence (AI) and Machine Learning (ML) in Systems Engineering. As the demand for designing systems increases, so have their requirements. Systems are being designed on shorter schedules and smaller budgets, yet performance and capability are increasing. Simply put, systems are required to do more with less. This paradigm offers a unique challenge to designers and is being addressed through AI and ML. AI and ML have been proposed in many engineering problems, often showing significant improvements for solving specific problems. In some cases, AI and ML offer the only solution. This panel will explore the use of AI and ML across Systems Engineering. Our panelists are spread across industry, government, and academic organizations and offer the diverse perspectives of each.
Topic: CIE SEIKM Panel: AI / ML in Systems Engineering
Time: Sep 18, 2020 01:00 PM Eastern Time (US and Canada)
Join Zoom Meeting
Meeting ID: 987 8031 4485
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Dr. Kathryn Jablokow
DED/CIE Special Joint Session
Wednesday, August 19th
11:35 am - 12:55 pm EDT
In this overview of NSF programs, Engineering Design & Systems Engineering (EDSE) Program Director Kathryn Jablokow will highlight NSF core programs and a variety of cross-cutting opportunities relevant to the engineering design community, along with a few key principles for successful proposal writing. In addition, she will discuss her vision for design research, including the implications of treating design as a system and the need to establish a more synergistic relationship between the engineering design and systems engineering communities.
Kathryn Jablokow is currently serving as the Program Director for the Engineering Design & Systems Engineering (EDSE) program in the Civil, Mechanical and Manufacturing Innovation (CMMI) Division at the National Science Foundation. In her academic life, Dr. Jablokow is a Professor of Engineering Design and Mechanical Engineering at Penn State University, where her research focuses on design cognition, high performance design teams, mobile robotics, and design education, among other topics. She has been part of the design community for over 30 years and is a co-developer of a Massive Open Online Course (MOOC) on creativity that has attracted more than 300,000 learners since 2013. Dr. Jablokow is a Senior Member of IEEE and a Fellow of ASME, as well as the recipient of ASME’s 2016 Ruth and Joel Spira Outstanding Design Educator Award.
The ASME-CIE Graduate Research Poster session is an opportunity for graduate students in the preliminary phase of their research programs (within 1 year of starting an MS or within 2 years of starting a PhD) to present their current work to the CIE research community. This session provides the students a chance to obtain external feedback on their preliminary research that may not yet be ready for presentation at the conference in archival form.
The poster session is organized by ASME’s Computers and Information in Engineering division (CIE) and will be held during the 2020 ASME IDETC-CIE Conference in St. Louis MO, during August 16-19, 2020.
Submission of Application Materials: May 31, 2020
Decision Notification: June 21, 2020
Final Abstract and Draft Poster: July 10, 2020
IDETC/CIE Conference: August 16-19, 2020
For more information and how to apply, click here.
Dear CIE Community-
Not sure what to be doing while we are working from home? How about recognizing the achievements of your peers. The CIE Executive Committee seeks nominations for the following awards:
Further details can be found at:
Questions or Nomination materials must be submitted in a single PDF file by 5pm EST, on May 24, 2020 to Cameron Turner (firstname.lastname@example.org) and should be addressed to ASME CIE Division Award Committee.
2020 CIE Awards Committee Chair
CIE Winter 2019-2020 Newsletter
The CIE 2017 Fall Newsletter is available for download.