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We are pleased to invite you to ASME CIE division’s Cybersecurity in Manufacturing Webinar on November 20th at 11:00am – 12:30pm EST.
The focus of this month’s webinar will be on Additive Manufacturing security. The webinar includes two talks:
The meeting details, along with abstracts and speaker bios are included below.
Zoom meeting Link: https://purdue-edu.zoom.us/j/95423513868?pwd=VlJjSSs0UUUyTkhoRnFDNkQxMWJzdz09
Meeting ID: 954 2351 3868 Passcode: 698597
Jitesh Panchal, Chair, ASME Computers and Information in Engineering (CIE) Division
Yan Wang, Awards Chair, ASME Computers and Information in Engineering (CIE) Division
Additive Manufacturing Security: Welcome to the New Frontier
Abstract: Additive Manufacturing (AM), often referred to as 3D printing, is a rapidly growing multibillion-dollar industry. AM is increasingly used to manufacture functional parts, including components of safety critical systems. However, its high degree on computerization and reliance on digital design files makes AM susceptible to a variety of cyber and cyber-physical attacks. This talk will provide an introduction in AM Security, a new and highly inter-disciplinary field of research. On the example of several selected attacks, this talk will outline novel challenges that the security of this manufacturing technology faces. While cyber-security is a necessary component of AM Security, numerous characteristic aspects of this manufacturing technology require special considerations. Fortunately, novel approaches have emerged that address some of the identified security threats. This talk will conclude with a summary of current state of the field and point out limitations that must be addressed by the research community in the future.
Speaker Bio: Dr. Mark Yampolskiy is an Associate Professor at Auburn University, department of Computer Science and Software Engineering (CSSE). He is also an Affiliated Faculty with Auburn Cyber Research Center (ACRC) and National Center for Additive Manufacturing Excellence (NCAME). He was among the pioneers and is one of the leading experts in the field of Additive Manufacturing Security. His research interests include the cyber-physical means of attack and defense in AM.
Manufacturing Security: Yes, Mechanical Engineers can Protect Designs and Intellectual Property
Abstract: Additive manufacturing (AM), also called 3D printing, is now used for manufacturing parts that have been deployed in operational aerospace systems. AM is a completely digital system until the part is manufactured on a 3D printer. The cyber-physical nature of the process chain exposes it to cybersecurity risks that include sabotage, intellectual property theft and counterfeiting. Cybersecurity methods such as access control, password protection and encryption can be applied to design files but these methods do not protect against production of high quality parts from stolen files and reverse engineering. Security should be used as a design constraint like any other product performance metric. This talk will introduce the design based security paradigm with examples such as embedded features in the CAD models that do not allow printing high quality parts by unauthorized users, anti-reverse engineering methods and genuine product identification methods. The fundamentally different process chain of AM compared to the traditional manufacturing methods requires a new design thinking that can lead to high quality products with security embedded in the design or the physical product.
Speaker Bio: Dr. Nikhil Gupta is a professor of Mechanical and Aerospace Engineering at New York University. He is affiliated with NYU Center for Cybersecurity. His research program is focused on additive manufacturing, including security and manufacturability of products, machine learning methods for materials characterization and lightweight composite materials. Dr. Gupta’s research directions on additive manufacturing security are supported by National Science Foundation, SecureAmerica Institute as well as industry. He is an author of over 205 journal papers and book chapters, inventor of 4 US patents and serves on the editorial board of journals including Composites Part B, Materials Performance and Characterization and Materials Science and Engineering A.
The new CIE webinar will feature a panel of experts discussing the use of Artificial Intelligence (AI) and Machine Learning (ML) in Systems Engineering. As the demand for designing systems increases, so have their requirements. Systems are being designed on shorter schedules and smaller budgets, yet performance and capability are increasing. Simply put, systems are required to do more with less. This paradigm offers a unique challenge to designers and is being addressed through AI and ML. AI and ML have been proposed in many engineering problems, often showing significant improvements for solving specific problems. In some cases, AI and ML offer the only solution. This panel will explore the use of AI and ML across Systems Engineering. Our panelists are spread across industry, government, and academic organizations and offer the diverse perspectives of each.
Topic: CIE SEIKM Panel: AI / ML in Systems Engineering
Time: Sep 18, 2020 01:00 PM Eastern Time (US and Canada)
Join Zoom Meeting
Meeting ID: 987 8031 4485
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Dr. Kathryn Jablokow
DED/CIE Special Joint Session
Wednesday, August 19th
11:35 am - 12:55 pm EDT
In this overview of NSF programs, Engineering Design & Systems Engineering (EDSE) Program Director Kathryn Jablokow will highlight NSF core programs and a variety of cross-cutting opportunities relevant to the engineering design community, along with a few key principles for successful proposal writing. In addition, she will discuss her vision for design research, including the implications of treating design as a system and the need to establish a more synergistic relationship between the engineering design and systems engineering communities.
Kathryn Jablokow is currently serving as the Program Director for the Engineering Design & Systems Engineering (EDSE) program in the Civil, Mechanical and Manufacturing Innovation (CMMI) Division at the National Science Foundation. In her academic life, Dr. Jablokow is a Professor of Engineering Design and Mechanical Engineering at Penn State University, where her research focuses on design cognition, high performance design teams, mobile robotics, and design education, among other topics. She has been part of the design community for over 30 years and is a co-developer of a Massive Open Online Course (MOOC) on creativity that has attracted more than 300,000 learners since 2013. Dr. Jablokow is a Senior Member of IEEE and a Fellow of ASME, as well as the recipient of ASME’s 2016 Ruth and Joel Spira Outstanding Design Educator Award.
The ASME-CIE Graduate Research Poster session is an opportunity for graduate students in the preliminary phase of their research programs (within 1 year of starting an MS or within 2 years of starting a PhD) to present their current work to the CIE research community. This session provides the students a chance to obtain external feedback on their preliminary research that may not yet be ready for presentation at the conference in archival form.
The poster session is organized by ASME’s Computers and Information in Engineering division (CIE) and will be held during the 2020 ASME IDETC-CIE Conference in St. Louis MO, during August 16-19, 2020.
Submission of Application Materials: May 31, 2020
Decision Notification: June 21, 2020
Final Abstract and Draft Poster: July 10, 2020
IDETC/CIE Conference: August 16-19, 2020
For more information and how to apply, click here.
Dear CIE Community-
Not sure what to be doing while we are working from home? How about recognizing the achievements of your peers. The CIE Executive Committee seeks nominations for the following awards:
Further details can be found at:
Questions or Nomination materials must be submitted in a single PDF file by 5pm EST, on May 24, 2020 to Cameron Turner (email@example.com) and should be addressed to ASME CIE Division Award Committee.
2020 CIE Awards Committee Chair
CIE Winter 2019-2020 Newsletter
The CIE 2017 Fall Newsletter is available for download.