News & Updates

• InterPACK Achievement Award

  InterPack Achievement Award is given to a single individual once every year at the ASME InterPACK Conference.  Candidates should have demonstrated excellence and international recognition in the area of research and development related to electronic packaging, as well as service to the  technical community at large. The scientific and technical leadership is demonstrated by the refereed publications (quality and number), patents awarded, products developed, students advised, etc. candidates must also have a demonstrated leadership role in InterPACK over the years, such as  organizational leadership, track leadership, session chairing, paper presentations and reviews, and so forth. As a general guideline, scientific and technical contributions count for two-thirds of the evaluation score and service counts to one-third of the score.

  Past Winners Include:

  Year	InterPACK Achievement Award	Affiliation
  1999	Alan Kraus (Dedicated Conference)	Naval Postgraduate School
  2001	Wataru Nakayama	ThermTech International & Tokyo Institute of Technology
  2003	Richard Chu	IBM Corporation
  2005	Not Awarded
  2007	Avram Bar-Cohen	University of Maryland
  2009	William Chen and Dereje Agonafer	ASE and University of Texas at Arlington
  2011	Yogendra Joshi	Georgia Institute of Technology
  2013	Y.C. Lee	University of Colorado
  2015	Bahgat G. Sammakia	Binghamton University
  2017	Ken Goodson	Stanford University
  2018	Ravi Mahajan	Intel
  2019	Abhijit Dasgupta	University of Maryland
  2020

  Submissions for the 2020 award are being accepted through September 14. For more information: https://www.asme.org/about-asme/honors-awards/unit-awards/interpack-achievement-award or contact EPPD Executive Committee Chair Amy Spencer Fleischer (afleisch@calpoly.edu).
  Posted by BarbaraZlatnik992 on 7 months ago
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