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Prof. Cristian H. Amon with University of Toronto has been announced as winner of InterPACK2020 Achievement Award. Prof. Amon on will accept his award and give a presentation on October 28th, 2020. during the International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems InterPACK), being held virtually October 27-29,, 2020. Registration for the conference is open. Visit https://event.asme.org/InterPACK for more information.
InterPACK Achievement Award is given to a single individual once every year at the ASME InterPACK Conference. Candidates should have demonstrated excellence and international recognition in the area of research and development related to electronic packaging, as well as service to the technical community at large. The scientific and technical leadership is demonstrated by the publications, patents awarded, technologies and products developed, and students advised. Candidates must also have a demonstrated leadership role in InterPACK over the years, such as organizational leadership, track leadership, session chairing, paper presentations and reviews, and so forth.
Previous winners include: