Official ASME Group

Electronic & Photonic Packaging Division

Electronic and Photonic Packaging Division (EPPD) objectives are international cooperation, understanding, and promotion of efforts and disciplines in Microelectronics, Photonics, Microwave and...
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News & Updates

  • Allan Kraus Thermal Management Medal: Call for Nominations

    The ALLAN KRAUS THERMAL MANAGEMENT MEDAL Selection Committee is requesting nominations for the 2021 Award.  Complete nominations (details below) must be submitted to the Committee Chair, Dr. Ravi Mahajan by email @ ravi.v.mahajan@intel.com no later than midnight (EST) February 15, 2021.  Incomplete nominations will not be considered for evaluation.

     This prestigious award recognizes an individual who has demonstrated outstanding achievements in thermal management of electronic systems and her or his commitment to the field of thermal science and engineering.  The nominee for the award should have significant contributions in thermal management of electronic systems demonstrated by successful product development, seminal papers, filed patents and/or leadership of research and development programs.  Details of the award and past winners may be found at https://www.asme.org/about-asme/honors-awards/achievement-awards/allan-kraus-thermal-management-medal.

     Form of Award

    Certificate, bronze medal, $1000 honorarium and travel expenses in accordance with ASME Travel Policy to attend the award presentation.

     Selection Committee

    The Allan Kraus Thermal Management Medal is administered by a selection committee appointed by the Committee on Honors upon the recommendation of the EPPD.

     Review Process

    Nominations for the award will be solicited by announcements at numerous ASME related forums and in mailing lists.  Nominations will be accepted from any individual who has submitted a completed nomination package.  The Allan Kraus Thermal Management Medal Committee will review each nomination and then make a recommendation to the Committee on Honors.  All questions about the process and deadlines should be directed to Dr. Ravi Mahajan (ravi.v.mahajan@intel.com)

     Nomination Details

    Only candidates whose names and complete nominations have been submitted will be considered for the award.  The nomination package must include a curriculum vita of the nominee, a statement of qualification, and 3-5 letters of recommendation supporting the nomination.  These must be submitted as separate documents and not combined in a single file. The nominee for the award should have:  Significant contributions in thermal management of electronic systems demonstrated by successful product development, seminal papers, filed patents and/or leadership of research and development programs.

     Nomination Deadline

    February 15, 2021 to Award Committee

     2021 Selection Committee

    Ravi Mahajan, Intel Fellow, Intel Corporation, ravi.v.mahajan@intel.com

    Dr. Peter de Bock, Program Director, Advanced Research Projects Agency – Energy, U.S. Department of Energy, peter.debock@hq.doe.gov                 

    Amy S. Fleischer, Dean, College of Engineering, California Polytechnic State University, afleisch@calpoly.edu 

    Marta Rencz, Faculty member and former Head of Department at the Budapest University of Technology and Economics, rencz.marta@vik.bme.hu

     Yogendra Joshi, John M. McKenney and Warren D. Shiver Distinguished Chair in Building Mechanical Systems and Professor, Georgia Institute of Technology, GW Woodruff School of Mechanical Engineering, yogendra.joshi@me.gatech.edu

     Cristina Amon, Professor, Mechanical Engineering, Alumni Distinguished Professor in Bioengineering, Dean Emerita, Faculty of Applied Science and Engineering, cristina.amon@utoronto.ca

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  • "A Tribute to Prof. Avram Bar-Cohen" - Journal of Electronic Packaging Special Issue - Call for Papers

     This Special Issue of the ASME Journal of Electronic Packaging is dedicated to Prof. Avram Bar-Cohen, who passed away on October 10, 2020. Avi helped to pioneer the wider field of thermal management electronics packaging and mentored over 70 graduate students at four institutions of higher education, all while serving as a prestigious member of academia, industry, and government. Papers in all disciplines of electronics thermal management are solicited here in honor of Prof. Bar-Cohen.

    For more information, download the attached flyer. 

    Important links:

    ASME Journal of Electronic Packaging

    ASME's Guide for Journal Authors

    Submit Manuscript

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