"A Tribute to Prof. Avram Bar-Cohen" - Journal of Electronic Packaging Special Issue - Call for Papers

Official ASME Group

Electronic & Photonic Packaging Division

Electronic and Photonic Packaging Division (EPPD) objectives are international cooperation, understanding, and promotion of efforts and disciplines in Microelectronics, Photonics, Microwave and...
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  • "A Tribute to Prof. Avram Bar-Cohen" - Journal of Electronic Packaging Special Issue - Call for Papers

     This Special Issue of the ASME Journal of Electronic Packaging is dedicated to Prof. Avram Bar-Cohen, who passed away on October 10, 2020. Avi helped to pioneer the wider field of thermal management electronics packaging and mentored over 70 graduate students at four institutions of higher education, all while serving as a prestigious member of academia, industry, and government. Papers in all disciplines of electronics thermal management are solicited here in honor of Prof. Bar-Cohen.

    For more information, download the attached flyer. 

    Important links:

    ASME Journal of Electronic Packaging

    ASME's Guide for Journal Authors

    Submit Manuscript

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