"A Tribute to Prof. Avram Bar-Cohen" - Journal of Electronic Packaging Special Issue - Call for Papers

Official ASME Group

Electronic & Photonic Packaging Division

Electronic and Photonic Packaging Division (EPPD) objectives are international cooperation, understanding, and promotion of efforts and disciplines in Microelectronics, Photonics, Microwave and...
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<a href="https://community.asme.org/cfs-file.ashx/__key/communityserver-blogs-components-weblogfiles/00-00-00-18-37/1106.Prof.-Bar_2D00_Cohen.jpg"><img src="https://community.asme.org/resized-image.ashx/__size/450x0/__key/communityserver-blogs-components-weblogfiles/00-00-00-18-37/1106.Prof.-Bar_2D00_Cohen.jpg" border="0" alt=" " /></a>This Special Issue of the ASME Journal of Electronic Packaging is dedicated to Prof. Avram Bar-Cohen, who passed away on October 10, 2020. Avi helped to pioneer the wider field of thermal management electronics packaging and mentored over 70 graduate students at four institutions of higher education, all while serving as a prestigious member of academia, industry, and government. Papers in all disciplines of electronics thermal management are solicited here in honor of Prof. Bar-Cohen.
For more information, download the attached flyer.&nbsp;
Important links:
<a href="https://asmedigitalcollection.asme.org/electronicpackaging" title="ASME Journal of Electronic Packaging">ASME Journal of Electronic Packaging</a>
<a href="https://www.asme.org/wwwasmeorg/media/resourcefiles/shop/journals/asme_guide_for_journal_authors_final.pdf" title="ASME's Guide for Journal Authors">ASME&#39;s Guide for Journal Authors</a>
<a href="https://journaltool.asme.org/home/JournalDescriptions.cfm?JournalID=5&amp;Journal=EP" title="Submit Manuscript">Submit Manuscript</a><div style="clear:both;"></div>

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"A Tribute to Prof. Avram Bar-Cohen" - Journal of Electronic Packaging Special Issue - Call for Papers

This Special Issue of the ASME Journal of Electronic Packaging is dedicated to Prof. Avram Bar-Cohen, who passed away on October 10, 2020. Avi helped to pioneer the wider field of thermal management electronics packaging and mentored over 70 graduate students at four institutions of higher education, all while serving as a prestigious member of academia, industry, and government. Papers in all disciplines of electronics thermal management are solicited here in honor of Prof. Bar-Cohen.

For more information, download the attached flyer.

Important links:

ASME Journal of Electronic Packaging

ASME's Guide for Journal Authors

Submit Manuscript

JEP_SI_A_Tribute_to_Prof. Avi Bar_Cohen.pdf (210.5 KB)

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"A Tribute to Prof. Avram Bar-Cohen" - Journal of Electronic Packaging Special Issue - Call for Papers

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Electronic & Photonic Packaging Division

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