Official ASME Group

Electronic & Photonic Packaging Division

Electronic and Photonic Packaging Division (EPPD) objectives are international cooperation, understanding, and promotion of efforts and disciplines in Microelectronics, Photonics, Microwave and...
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News & Updates

  • InterPACK 2020 Panel – Recordings available

    The panel discussion sessions at InterPACK 2020, held virtually October 27 – 29, are available for viewing: https://event.asme.org/InterPACK-2020/Program-2/Panels. These seven panels addressed the following topics:

    • Aerospace Electronics
    • Printing Technologies for Additive Electronics
    • HIR Challenges and Opportunities
    • Women in Engineering
    • Mobile, IOT and Computer Device Applications: Therma and Mechanical Challenges
    • Advances in Wearable/Wireless Flexible Electronics: Thermal and Mechanical Challenges and Opportunities
    • Potential of Additive Manufacturing for Power Electronics

    Mark your calendar for InterPACK 2021, occurring virtually October 26 – 28. The Call for Abstracts is still open but don’t wait! The deadline to submit has been extended to March 29. Learn more at https://event.asme.org/InterPACK

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