Official ASME Group

Electronic & Photonic Packaging Division

Electronic and Photonic Packaging Division (EPPD) objectives are international cooperation, understanding, and promotion of efforts and disciplines in Microelectronics, Photonics, Microwave and...
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News & Updates

  • InterPACK Achievement Award

    InterPack Achievement Award is given to a single individual once every year at the ASME InterPACK Conference.  Candidates should have demonstrated excellence and international recognition in the area of research and development related to electronic packaging, as well as service to the  technical community at large. The scientific and technical leadership is demonstrated by the refereed publications (quality and number), patents awarded, products developed, students advised, etc. candidates must also have a demonstrated leadership role in InterPACK over the years, such as  organizational leadership, track leadership, session chairing, paper presentations and reviews, and so forth. As a general guideline, scientific and technical contributions count for two-thirds of the evaluation score and service counts to one-third of the score.

    Past Winners Include:

    Year InterPACK Achievement Award Affiliation
    1999 Alan Kraus (Dedicated Conference) Naval Postgraduate School
    2001 Wataru Nakayama ThermTech International & Tokyo Institute of Technology
    2003 Richard Chu IBM Corporation
    2005 Not Awarded  
    2007 Avram Bar-Cohen University of Maryland
    2009 William Chen and Dereje Agonafer ASE and University of Texas at Arlington
    2011 Yogendra Joshi Georgia Institute of Technology
    2013 Y.C. Lee University of Colorado
    2015 Bahgat G. Sammakia Binghamton University
    2017 Ken Goodson Stanford University
    2018 Ravi Mahajan Intel
    2019 Abhijit Dasgupta University of Maryland
    2020    
    Submissions for the 2020 award are being accepted through September 14. For more information: https://www.asme.org/about-asme/honors-awards/unit-awards/interpack-achievement-award or contact EPPD Executive Committee Chair Amy Spencer Fleischer (afleisch@calpoly.edu).
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  • Call for Nominations: InterPACK Achievement Award for 2020

    Dear InterPACK Community,

    Nominations are solicited for the prestigious InterPACK Achievement Award, to be awarded at the InterPACK 2020 Conference to be held from Oct. 27th through Oct. 29th, 2020 in a virtual format.

    The InterPack Achievement Award is given to a single individual at each ASME InterPACK Conference. Candidates should have demonstrated excellence and achieved international recognition in the area of research and development related to electronic packaging, as well as demonstrated a high level of service to the technical community at large. Scientific and technical leadership can be demonstrated by multiple means including publications, patents awarded, technologies and products developed, and students advised. Candidates must also have a demonstrated leadership role in InterPACK over the years, such as organizational leadership, track leadership, session chairing, paper presentations and reviews.

    Previous winners include: 1999 Alan Kraus, Naval Postgraduate School 2001 Prof. Wataru Nakayama, ThermTech International & Tokyo Institute of Technology 2003 Richard Chu, IBM Corporation 2005 Prof. Avram Bar-Cohen, University of Maryland 2007 Prof. Dereje Agonafer, University of Texas at Arlington 2009 Prof. Yogendra Joshi, Georgia Institute of Technology 2013 Prof. Y.C. Lee, University of Colorado 2015 Prof. Bahgat G. Sammakia, Binghamton University 2017 Prof. Ken Goodson, Stanford University 2018 Dr. Ravi Mahajan, Intel Corporation 2019 Prof. Abhijit Dasgupta, University of Maryland

    The nomination package should include:

    1. Cover letter from nominator(s)

    2. One-page justification of the candidacy

    3. Two-page summary resume including the candidate's career highlights as well as complete contact information.

    4. Two reference letters (including the one from the nominator)

    Please send the nomination package to the following members of the Award Committee no later than Sep. 14th, 2020, 5:00 PM US Pacific Time.

    Prof. Y.C. Lee, (y.c.lee@Colorado.EDU)

    Prof. Alfonso Ortega, (alfonso.ortega@villanova.edu)

    Dr. Rama Ramakrishna, (koneru_rama@yahoo.com)

    Prof. Yogendra Joshi, (yogendra.joshi@me.gatech.edu)

    Incomplete nominations or those submitted after the deadline will not be considered. We would like to thank you on behalf of the InterPACK Organizing Committee for participating in the nominations process.

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  • Call for Nominations: Member-at-Large, EPPD Executive Committee

    Deadline: July 31, 2020

    The Executive Committee of the Electronic and Photonic Packaging Division (EPPD) is seeking nominations for a new member-at-large committee member.

    According to the EPPD Rules of Operation, "Each year, an open nomination shall be conducted within the Division to elect the new Member-at-Large of the Executive Committee. The Memberat-Large elect shall commit to serve for a five-year term with annual rotation through the following seniority ladder: Member-at-Large to Secretary to Treasurer to Vice Chair to Chair." Main duties of the member-at-large during the first year include participating in and contributing to the EPPD Executive Committee decision making process, updating and maintaining (working with ASME staff) the EPPD webpage, and carrying out special tasks assigned by the Executive Committee from time to time. In keeping with the rotation between industry and academia, the 2020 memberat-large should be from academia or a National Lab. Every member of EPPD in good standing (primary or secondary) is eligible to submit nominations (including self-nominations) to the Chair of the Nominating Committee. The nominee should already be (or be willing to become) an EPPD member.

    Please send nominations to the Nominating Committee Chair, Mehdi Asheghi (masheghi@stanford.edu) by July 31, 2020. The nomination should include the following material:

    1. Nomination letter (Maximum 2 pages)
    2. Copy of the nominee's curriculum vitae highlighting specific involvement in ASME activities in general and EPPD in particular. These activities may include conference/journal publications, patents, session or topic organization, membership on journal editorial board(s), journal and/or conference papers reviewed (Maximum 2 pages)

    The nomination letter should clearly state:

    1. the nominee's qualifications
    2. experience in engaging the electronic and photonic packaging communities,
    3. interest in working with the EPPD, and record of sustained professional services.

    It is assumed that the nominator has already received concurrence from the nominee that she/he is willing to serve if elected. Thank you 


    Mehdi Asheghi

    Adjunct Professor

    Stanford University

    Mechanical Engineering Department

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  • Reminder: 2020 ASME EPPD Awards: Call for Nominations

    A reminder that the nominations are due by July 19, 2020 (SUNDAY)

    2020 ASME EPPD Awards: Call for Nominations Deadline: Sunday, July 19, 2020

    ASME’s Electronic and Photonic Packaging Division (EPPD) is soliciting nominations for the following annual division awards: 1. EPPD Excellence in Mechanics Award 2. EPPD Women Engineer Award 3. EPPD Early Career Engineer Award 4. EPPD Student Member of the Year Award

    Complete nominations should be submitted by email to both SB Park (sbpark@binghamton.edu) and Koneru Ramakrishna (rama@ieee.org), Chair & CoChair of the 2020 EPPD Awards Committee, and are due by Sunday, July 19, 2020. Please include the words “Nomination for EPPD Award: category” in the subject line of your email. The following items are required in each nomination packet: 1. Nomination letter summarizing Nominee’s qualifications and accomplishments 2. Nominee’s CV/Bio (50 pages or less). 3. Up to 3 letters of support. 4. Nominee’s ASME membership status and primary/secondary membership in EPPD. Adding ASME membership numbers helps, but, not required. 5. State nominee’s current ASME membership status, ASME member number, and the primary Division the nominee is associated with.

    The nominations will be evaluated by the EPPD Awards Committee, which consists of past senior members of EPPD and some of the past winners. The awards will be announced in prior to 2020 ASME InterPACK and will be presented during the Conference.

    Details of the Awards follow. 1. Excellence in Mechanics Award a. The award is to recognize outstanding contributions to the applications of engineering mechanics in the field of electronic and/or photonic packaging, including stress analysis, reliability study, experimental methods and computational modeling. b. Emphasis will be placed on seminal work and product innovation and product development demonstrated through technical publications and patents.

    2. EPPD Women Engineer Award a. The award is to recognize a woman engineer with significant technical achievements in the area of electronic and photonic packaging demonstrated through papers, patents, or product development. b. Contributions to EPPD activities (conferences, committees, Journal of Electronic Packaging, K16 etc.) are also important considerations. c. Nominee must be a primary or a secondary member of EPPD for at least last 1 year prior to nomination, or has demonstrated active involvement and outstanding contributions to InterPACK conference for the past 3 consecutive years.

    3. EPPD Early Career Engineer Award a. The award is to recognize a young engineer with significant technical achievements in the career in the area of electronic and photonic packaging demonstrated through papers, patents, or product development. b. Contributions to EPPD activities (conferences, committees, Journal of Electronic Packaging, K16 etc.) are very important. c. Nominee must be a primary or a secondary member of EPPD for at least last 1 year prior to nomination, or has demonstrated active involvement and outstanding contributions to InterPACK conference for the past 3 consecutive years. d. Nominee must be within 10 years since the last degree received before December 31, 2020 (the year of the award).

    4. EPPD Student Member of the Year Award a. Nominee must be enrolled as a full time undergraduate or graduate student conducting research in the area of electronic and photonic packaging. b. The award is to recognize a current student, who has excelled in research and has shown demonstrated strong contributions to the field of electronic and photonic packaging. c. Must demonstrate active participation in conferences such as EPPD’s InterPACK, IMECE, ITherm and such.

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  • 2020 ASME EPPD Awards: Call for Nominations

    2020 ASME EPPD Awards: Call for Nominations

    Deadline:   Sunday, July 19, 2020

     

    ASME’s Electronic and Photonic Packaging Division (EPPD) is soliciting nominations for the following annual division awards:

    1. EPPD Excellence in Mechanics Award
    2. EPPD Women Engineer Award
    3. EPPD Early Career Engineer Award
    4. EPPD Student Member of the Year Award

     

    Complete nominations should be submitted by email to both SB Park (sbpark@binghamton.edu) and Koneru Ramakrishna (rama@ieee.org), Chair & Co-Chair of the 2020 EPPD Awards Committee, and are due by Sunday, July 19, 2020. Please include the words “Nomination for EPPD Award: category” in the subject line of your email. The following items are required in each nomination packet:

    1. Nomination letter summarizing Nominee’s qualifications and accomplishments
    2. Nominee’s CV/Bio (50 pages or less).
    3. Up to 3 letters of support.
    4. Nominee’s ASME membership status and primary/secondary membership in EPPD. Adding ASME membership numbers helps, but, not required.
    5. State nominee’s current ASME membership status, ASME member number, and the primary Division the nominee is associated with.

     

    The nominations will be evaluated by the EPPD Awards Committee, which consists of past senior members of EPPD and some of the past winners. The awards will be announced in prior to 2020 ASME InterPACK and will be presented during the Conference.

     

    Details of the Awards follow.

    1. 1.    Excellence in Mechanics Award
      1. The award is to recognize outstanding contributions to the applications of engineering mechanics in the field of electronic and/or photonic packaging, including stress analysis, reliability study, experimental methods and computational modeling.
      2. Emphasis will be placed on seminal work and product innovation and product development demonstrated through technical publications and patents.

     

    1. 2.    EPPD Women Engineer Award
      1. The award is to recognize a woman engineer with significant technical achievements in the area of electronic and photonic packaging demonstrated through papers, patents, or product development.
      2. Contributions to EPPD activities (conferences, committees, Journal of Electronic Packaging, K16 etc.) are also important considerations.
      3. Nominee must be a primary or a secondary member of EPPD for at least last 1 year prior to nomination, or has demonstrated active involvement and outstanding contributions to InterPACK conference for the past 3 consecutive years.

     

    1. 3.    EPPD Early Career Engineer Award
      1. The award is to recognize a young engineer with significant technical achievements in the career in the area of electronic and photonic packaging demonstrated through papers, patents, or product development.
      2. Contributions to EPPD activities (conferences, committees, Journal of Electronic Packaging, K16 etc.) are very important.
      3. Nominee must be a primary or a secondary member of EPPD for at least last 1 year prior to nomination, or has demonstrated active involvement and outstanding contributions to InterPACK conference for the past 3 consecutive years.
      4. Nominee must be within 10 years since the last degree received before December 31, 2020 (the year of the award).

     

    1. 4.    EPPD Student Member of the Year Award
      1. Nominee must be enrolled as a full time undergraduate or graduate student conducting research in the area of electronic and photonic packaging.
      2. The award is to recognize a current student, who has excelled in research and has shown demonstrated strong contributions to the field of electronic and photonic packaging.
      3. Must demonstrate active participation in conferences such as EPPD’s InterPACK, IMECE, ITherm and such.

     

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  • 2020 Call for Nominations: Member-at-Large, EPPD Executive Committee

    Call for Nominations: Member-at-Large, EPPD Executive Committee 

    Deadline: July 25, 2020

    The Executive Committee of the Electronic and Photonic Packaging Division (EPPD) is seeking nominations for a new member-at-large committee member.

    According to the EPPD Rules of Operation, "Each year, an open nomination shall be conducted within the Division to elect the new Member-at-Large of the Executive Committee. The Member-at-Large elect shall commit to serve for a five-year term with annual rotation through the following seniority ladder: Member-at-Large to Secretary to Treasurer to Vice Chair to Chair." Main duties of the member-at-large during the first year include participating in and contributing to the EPPD Executive Committee decision making process, updating and maintaining (working with ASME staff) the EPPD webpage, and carrying out special tasks assigned by the Executive Committee from time to time.  In keeping with the rotation between industry and academia, the 2020 member-at-large should be from academia or a National Lab. Every member of EPPD in good standing (primary or secondary) is eligible to submit nominations (including self-nominations) to the Chair of the Nominating Committee.  The nominee should already be (or be willing to become) an EPPD member.

    Please send nominations to the Nominating Committee Chair, Mehdi Asheghi (masheghi@stanford.edu) by July 25, 2020. The nomination should include the following material:

    1.   Nomination letter (Maximum 2 pages)

    2.   Copy of the nominee's curriculum vitae highlighting specific involvement in ASME activities in general and EPPD in particular. These activities may include conference/journal publications, patents, session or topic organization, membership on journal editorial board(s), journal and/or conference papers reviewed (Maximum 2 pages)

    The nomination letter should clearly state:

    1.    the nominee's qualifications

    2.    experience in engaging the electronic and photonic packaging communities,

    3.    interest in working with the EPPD, and record of sustained professional services.

    It is assumed that the nominator has already received concurrence from the nominee that she/he is willing to serve if elected.

    Thank you

    Mehdi Asheghi

    Adjunct Professor

    Stanford University

    Mechanical Engineering Department

     

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  • EPPD Awards: 2020 Call for Nominations

    ASME’s Electronic and Photonic Packaging Division (EPPD) is soliciting nominations for the following annual division awards:


    1. EPPD Excellence in Mechanics Award
    2. EPPD Women Engineer Award
    3. EPPD Early Career Engineer Award
    4. EPPD Student Member of the Year Award

    Complete nominations should be submitted by email to both SB Park (sbpark@binghamton.edu) and Koneru Ramakrishna (rama@ieee.org), Chair & Co-Chair of the 2020 EPPD Awards Committee, and are due by Sunday, July 5, 2020.

    Click here for more information. 

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  • Call for Nominations: 2019 InterPACK Achievement Award

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  • An Important Message from the ASME President

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