Your request has been sent. You should be hearing from a site administrator shortly.
Electronic Packaging Enginner
Manufacturing & Processing
The Electronic and Photonic Packaging Division (EPPD) of ASME has as its objectives international cooperation, understanding, and promotion of efforts and disciplines in Microelectronics, Photonics, Microwave and Microelectromechanical Systems Packaging Engineering. The Division is concerned with all design and engineering aspects related to theoretical (analytical and computer-aided) and experimental problems and results associated with the application of methods and approaches of engineering and applied mechanics to the analysis, design, manufacturing, testing and operation of microelectronics, optoelectronics and photonics components, devices, equipment and systems.
"The Mechanical Engineering Magazine is
educational and keeps me up to date in engineering."
— Ibrahim Ashie, ASME Life Member since 1971
Receive exclusive resources and a free ME Magazine subscription,
discounts on training, conferences & publications, and join thousands of dedicated engineers.
More about ASME - The AmericanSociety of Mechanical Engineers