Your request has been sent. You should be hearing from a site administrator shortly.
The Electronic and Photonic Packaging Division (EPPD) of ASME has as its objectives international cooperation, understanding, and promotion of efforts and disciplines in Microelectronics, Photonics, Microwave and Microelectromechanical Systems Packaging Engineering. The Division is concerned with all design and engineering aspects related to theoretical (analytical and computer-aided) and experimental problems and results associated with the application of methods and approaches of engineering and applied mechanics to the analysis, design, manufacturing, testing and operation of microelectronics, optoelectronics and photonics components, devices, equipment and systems.
"Since I started my ASME membership almost 41 years ago, when I was a young engineer in an underdeveloped country I have found countless opportunities in my career due to ASME."
Rafael G. Beltran Pulido, PE ASME Life Member since 1976
Receive exclusive resources and a free ME Magazine subscription,
discounts on training, conferences & publications, and join thousands of dedicated engineers.
More about ASME - The AmericanSociety of Mechanical Engineers