Official ASME Group

Electronic & Photonic Packaging Division

Electronic and Photonic Packaging Division (EPPD) objectives are international cooperation, understanding, and promotion of efforts and disciplines in Microelectronics, Photonics, Microwave and...
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Featured Events

To view other events that may be of interest, please visit the ASME Calendar of Events.  

Past Events

InterPACK® 2019: International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, Hilton Anaheim, Anaheim, CA, October 7 – 9, 2019

InterPACK 2017
August 29 – September 1, 2017
San Francisco, California

 InterPACK 2013
July 16-18, 2013
San Francisco, CA