Official ASME Group

Electronic & Photonic Packaging Division

Electronic and Photonic Packaging Division (EPPD) objectives are international cooperation, understanding, and promotion of efforts and disciplines in Microelectronics, Photonics, Microwave and...
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Honors & Awards

Recognition of outstanding achievement in engineering is one of the major objectives of ASME. Through its programs of honors and awards, ASME recognizes outstanding contributions to the art and science of engineering.

Society Awards:

Division Awards:

  • Thermal Management Award (Refer to Allan Kraus Thermal Management Medal)
    Note: EPPD Division Level Thermal Award Winners are not eligible for the Allan Kraus Thermal Management Medal
    For outstanding contributions to thermal management of electronic and/or photonic components and systems, including design, optimization, experimental techniques, modeling and simulation.
  • Mechanics Award
    For outstanding contributions to the applications of engineering mechanics in the field of electronic and/or photonic packaging, including stress analysis, reliability study, experimental methods and computational modeling.
  • Women In Engineering Award
    To recognize a women engineer with significant technical achievements in the area of electronic and photonic packaging demonstrated through papers, patents, or product development.
  • Young Engineer Award
    To recognize a young engineer with significant technical achievements in the career in the area of electronic and photonic packaging demonstrated through papers, patents, or product development.
  • Student Member of the Year Award
    To recognize a current student who has excelled in research and has shown promise to be a strong contributor in the field of electronic and photonic packaging.
  • K-16 Clock Award
    (Sponsored by the K-16 Heat Transfer in Electronic Equipment Committee and the Electronic & Photonic Packaging Division)
    To recognize outstanding and continuing contributions to the science and engineering of heat transfer in electronics
  • InterPACK Achievement Award
    InterPack Achievement Award is given to a single individual once every year at the ASME InterPACK Conference. Candidates should have demonstrated excellence and international recognition in the area of research and development related to electronic packaging, as well as service to the  technical community at large. 

Nominations link for processing division awards

Unit Award Nominations

Important Award Information For Recipients of Monetary Awards

Please note that honorariums cannot be distributed without receipt of applicable tax forms. If you are a recipient of a monetary award, you will be contacted by ASME staff regarding tax forms you will need to complete, as well as how to submit them to us.

2020 EPPD Awards- Call for Nominations

ASME's electronic and Photonic Packaging Division (EPPD) is soliciting nominations for the following annual division awards: 

1. EPPD Excellence in Mechanics Award

2. EPPD Women Engineer Award

3. EPPD Early Career Engineer Award

4. EPPD Student Member of the Year Award

Complete nominations should be submitted by email to both SB Park ( and Koneru Ramakrishna (, Chair & Co-Chair of the 2020 EPPD Awards Committee, and are due by Sunday, July 5, 2020.

For more information click here