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We are pleased to announce that ASME Journal of Computing and Information Science in Engineering is calling for papers for a Special Issue on Machine Learning Applications in Manufacturing. The CFP flyer is attached.
This Special Issue aims to harvest the latest efforts in theoretical as well as experimental aspects of ML and their applications in manufacturing. The paper submission deadline is July 1st, 2019.
Potential topics include, but are not limited to:
ML-based theoretical approaches for manufacturing ML for robotics and human-machine interaction ML for predictive maintenance, quality control, and process optimization ML for tasks scheduling and supply chain management ML for sustainable manufacturing ML for manufacturing process monitoring and control ML and data-driven design for manufacturing to enable better and faster fabrication of parts ML methods that provide insights for manufacturing process improvement ML methods that leverage material informatics for improved manufacturing
ML-based experimental case studies for smart manufacturing Advanced diagnostics, prognostics and asset health management Energy consumption modelling and optimization Advanced robotics (collaborative and adaptive robots) Digital twin Leveraging ML for hybrid manufacturing (additive and subtractive manufacturing) Data acquisition for novel manufacturing processes
Novel ML algorithm design for manufacturing Approaches to extract manufacturing knowledge using ML techniques Algorithms and approaches handling big data, data imbalance, uncertainty, data fusion, etc. Calibration and validation of ML-based patterns and models Addressing security, privacy, and cyber resilience/reliability issues Novel deep learning architecture for manufacturing domain problems Hybrid machine learning methods that combine data-driven and equation-based methods
Creation and sharing of research data that supports ML applications in manufacturing
Special Issue EditorsYing Liu, Cardiff University, UK, firstname.lastname@example.orgBin He, Shanghai University, China, email@example.comMahesh Mani, Allegheny Science & Technology, US, firstname.lastname@example.orgAnurag Purwar, Stony Brook University, US, email@example.comRahul Rai, University at Buffalo SUNY, US, firstname.lastname@example.org